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        - Sun Proprietary/Confidential: Internal Use Only -
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                        FIELD INFORMATION NOTICE
           (For Authorized Distribution by Enterprise Services)

FIN #: I0567-1

Create Date: Mar/19/04 
                                                       Mar/24/00

Top FIN/FCO Report: No

Products Reference: System Board Silicon Pad

Product Category: Server / System Board

Product Affected: 

Mkt_ID   Platform   Model   Description   Serial Number
------   --------   -----   -----------   -------------
Systems Affected
----------------
  -       E3000      ALL    Ultra Enterprise 3000           -
  -       E3500      ALL    Ultra Enterprise 3500           -
  -       E4000      ALL    Ultra Enterprise 4000           -
  -       E4500      ALL    Ultra Enterprise 4500           -
  -       E5000      ALL    Ultra Enterprise 5000           -
  -       E5500      ALL    Ultra Enterprise 5500           -
  -       E6000      ALL    Ultra Enterprise 6000           -
  -       E6500      ALL    Ultra Enterprise 6500           -
  -       E10000     ALL    Ultra Enterprise 10000          -

X-Options Affected
------------------
   -        -         -           -                       -

Parts Affected: 

Part Number   Description                          Model
-----------   -----------                          -----
565-1647-01   FRU. Kit, Electro-Wash, Mod Cleaner    -

References: 

FIN:  I0537-2

ECO:  WO_16821
ECO:  WO_22491

URL:  http://sdpsweb.central/FIN_FCO/FIN/FINI0567-1_dir/3102.pdf
      http://sdpsweb.central/FIN_FCO/FIN/FINI0567-1_dir/7100.pdf

Issue Description: 

------------------------------------------------------------------------ 
| Change of History                                                      |
| =================                                                      |
|   Date: March 19, 2004                                                 |
|   Sections Updated: Reference Section                                  |
|     . Deleted the following URL:                                       |
|       URL:  http://www.chemtronics.com/usmsds/3102.PDF                 |
|             http://www.chemtronics.com/usmsds/3102.DOC                 |
|                                                                        |
|     . Added the following URL:                                         |
|       URL:  http://sdpsweb.central/FIN_FCO/FIN/FINI0567-1_dir/3102.pdf |
|             http://sdpsweb.central/FIN_FCO/FIN/FINI0567-1_dir/7100.pdf |
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The thermal pad underneath the CPU module has a tendency to excrete
silicon oil when the pad is under pressure and heat. While not
conductive, the oil does attract contaminants that can be conductive or
insulate the connection between the module and the system board.

The excretion of silicone oil is an inherent characteristic of the
silicone-based pad material and can not be eliminated with current
technology.  

A longer term solution is being developed where by the pad material
will be sealed in an antistatic envelope, thus containing any excreted
silicone oil.

The silicone oil appears as a thick oily residue that precipitates from
the thermal pad which seeps down toward and onto adjacent components.
Often this residue will attract dust and debris.

Implementation: 

---
        |   |   MANDATORY (Fully Pro-Active)
         ---    
         
  
         ---
        |   |   CONTROLLED PRO-ACTIVE (per Sun Geo Plan) 
         --- 
         
                                
         ---
        | X |   REACTIVE (As Required)
         ---

Corrective Action: 

Enterprise Customers and authorized Field Service Representatives may
avoid the above mentioned problem by following the recommendations
as shown below:
        
When replacing a CPU module, use module cleaning kit (p/n: 565-1647-01)
to clean the system board connector pads.  The intent is not to remove
working modules but to only clean the pads on the system board where
defective modules are being replaced.

1. Wear an ESD Strap and place the system board on a static-free work
   surface in a well ventilated area.

2. Remove the suspect processor module(s) using the normal technique.

3. Do not spray electrowash solvent directly onto ECB assemblies or 
   components.  Instead, spray a small amount of electrowash solvent 
   onto a new lint free wipe and wipe on affected area of the system
   board/processor module to clean visible oil residue and debris.

4. Apply a small amount of electrowash solvent onto a new lint free wipe
   and clean the gold pads of the system board using a fresh wipe for
   each area to prevent transferring the residue.  Repeat as needed
   using a fresh wipe each time.

5. Using a clean wipe, repeat STEP 4 with a single final wipe stroke
   in one direction.

6. Soak a balled-up wipe with electrowash solvent and daub the exposed
   connector pins of the processor connector(s); Repeat as needed until
   they are clean.

7. Using a clean wipe, repeat STEP 6 with a single final wipe stroke in 
   one direction.  Allow to dry fully.

8. Use brush to remove any wipe fragments or debris.

9. Spray a small amount of electrowash solvent onto a new lint free 
   wipe and wipe off any visible debris and oil from the thermal pad
   itself.

10. Do a final inspection of all connector pins, connector pads, and
    neighboring components prior to re-assembly; clean as needed.

11. Reinstall modules using the approved technique (Torque sequence, etc.).

Comments: 

None 

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Implementation Footnote: 

i)   In case of MANDATORY FINs, Enterprise Services will attempt to    
     contact all affected customers to recommend implementation of 
     the FIN. 
   
ii)  For CONTROLLED PROACTIVE FINs, Enterprise Services mission critical    
     support teams will recommend implementation of the FIN  (to their  
     respective accounts), at the convenience of the customer. 

iii) For REACTIVE FINs, Enterprise Services will implement the FIN as the   
     need arises.
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All released FINs and FCOs can be accessed using your favorite network 
browser as follows:
 
SunWeb Access:
-------------- 
* Access the top level URL of http://sdpsweb.ebay/FIN_FCO/

* From there, select the appropriate link to query or browse the FIN and
  FCO Homepage collections.
 
SunSolve Online Access:
-----------------------
* Access the SunSolve Online URL at http://sunsolve.Corp/

* From there, select the appropriate link to browse the FIN or FCO index.

Supporting Documents:
---------------------
* Supporting documents for FIN/FCOs can be found on Edist.  Edist can be 
  accessed internally at the following URL: http://edist.corp/.
  
* From there, follow the hyperlink path of "Enterprise Services Documenta- 
  tion" and click on "FIN & FCO attachments", then choose the appropriate   
  folder, FIN or FCO.  This will display supporting directories/files for 
  FINs or FCOs.
   
Internet Access:
----------------
* Access the top level URL of https://infoserver.Sun.COM
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General:
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* Send questions or comments to finfco-manager@Sun.COM
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