Document Audience:INTERNAL
Document ID:I0937-1
Title:Instructions for resolving EMI gasket issue during replacement of I/O Module FRU on Sun StorEdge 3310 SCSI Array.
Copyright Notice:Copyright © 2005 Sun Microsystems, Inc. All Rights Reserved
Update Date:2003-03-24

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            - Sun Proprietary/Confidential: Internal Use Only -
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                        FIELD INFORMATION NOTICE
               (For Authorized Distribution by SunService)
FIN #: I0937-1
Synopsis: Instructions for resolving EMI gasket issue during replacement of I/O Module FRU on Sun StorEdge 3310 SCSI Array.
Create Date: Mar/20/03
SunAlert: No
Top FIN/FCO Report: No
Products Reference: Sun StorEdge 3310 SCSI Array
Product Category: Storage / Service
Product Affected: 
Systems Affected:
-----------------  
Mkt_ID    Platform    Model    Description                  Serial Number
------    --------    -----    -----------                  -------------
  -        ANYSYS       -      System Platform Independent        -   


X-Options Affected:
-------------------
Mkt_ID     Platform     Model     Description               Serial Number
------     --------     -----     -----------               -------------
  -          3310        ALL      Sun StorEdge 3310 Array         -
Parts Affected: 
Part Number     Description                         Model
-----------     -----------                         -----
370-5397-01	Host/Drv I/O Mod RAID LVD 2U	      -
370-5396-01	Host/Drv I/O Mod JBOD LVD 2U	      -
370-5524-01	Box 2U RAID LVD Chass+Midplane	      -
370-5393-01	Box 2U JBOD LVD Chass+Midplane	      -
References: 
URL  816-7292-13  http://infoserver.central/data/816/816-7292/pdf/
Issue Description: 
Replacement of RAID I/O Module FRUs in Sun StorEdge 3310 SCSI Arrays
may require that an extra procedure be performed due to an EMI gasket
issue.  This results from a change made to the location of the EMI
gasket.

This issue affects any Sun StorEdge 3310 SCSI Array where a defective
RAID I/O Module, P/N F370-5397-01 or F370-5396-01, must be replaced.
3310 Arrays will also be affected when the Chassis FRU, P/N
F370-5524-01 or F370-5393-01, must be replaced.

The problem can be identified by visual inspection of the Chassis and
I/O Module.  Inspect for a double gasket or a no gasket condition at
the top edge of the I/O Module faceplate.

The I/O Module top EMI gasket was moved from the Module faceplate to
the Chassis in November 2002.  The new location secures the gasket
under the rear cover and provides more surface area for the gasket
adhesive.  However, this change can cause a compatibility problem
between I/O Module FRUs and the Chassis.

Chassis made prior to November 2002 are not compatible with I/O modules
made after November 2002 unless the loose gasket provided in the FRU
box is applied.  Chassis made after November 2002 are not compatible
with I/O Modules made prior to November 2002 unless the I/O Module top
EMI gasket is removed.

If there is no gasket at the top edge of the I/O Module, radiated
emissions will exceed FCC standards.  If there are 2 gaskets at the top
edge of the I/O Module, there may be an insufficient seal on the bottom
of the I/O Module, possibly exceeding FCC standards.

This issue has been addressed by updating all I/O Module FRU's to
include a loose gasket, should one be required by support personnel.
All I/O modules in parts warehouses have the top gasket attached to the
faceplate.
Implementation: 
---
        |   |   MANDATORY (Fully Proactive)
         ---    
         
  
         ---
        |   |   CONTROLLED PROACTIVE (per Sun Geo Plan) 
         --- 
         
                                
         ---
        | X |   REACTIVE (As Required)
         ---
Corrective Action: 
The following recommendation is provided as a guideline for authorized
Sun Services Field Representatives who may encounter the above
mentioned problem.
      
Field service personnel should inspect the top edge of the I/O Module 
faceplate and the mating area on the Chassis prior to replacing either 
FRU.
  
Action is required in two cases: 

  CASE 1:
  -------

  If there is a gasket on both the top edge of the I/O Module faceplate 
  and the mating area on the Chassis, the top I/O Module gasket should be 
  removed.  Residual adhesive should also be removed.

  Case 2:
  -------

  If there is no gasket on either the top edge of the I/O Module faceplate 
  or the mating area of the Chassis, the loose gasket in the I/O Module 
  FRU box should be installed onto the top edge of the I/O Module faceplate.
  Installation instructions are provided with the extra gasket.

CAUTION: Do NOT discard gasket material packaged with FRU until you 
         confirm whether or not it is required.
Comments: 
None.

============================================================================
Implementation Footnote: 
i)   In case of MANDATORY FINs, Sun Services will attempt to contact   
     all affected customers to recommend implementation of the FIN. 
   
ii)  For CONTROLLED PROACTIVE FINs, Sun Services mission critical    
     support teams will recommend implementation of the FIN  (to their  
     respective accounts), at the convenience of the customer. 

iii) For REACTIVE FINs, Sun Services will implement the FIN as the   
     need arises.
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