Document Audience: | INTERNAL |
Document ID: | I1035-1 |
Title: | EMI gaskets and spring fingers on Sun Fire V1280 and Netra 1280 boards may detach and cause component damage when they fall into the system. |
Copyright Notice: | Copyright © 2005 Sun Microsystems, Inc. All Rights Reserved |
Update Date: | 2004-05-27 |
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- Sun Proprietary/Confidential: Internal Use Only -
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FIELD INFORMATION NOTICE
(For Authorized Distribution by SunService)
FIN #: I1035-1
Synopsis: EMI gaskets and spring fingers on Sun Fire V1280 and Netra 1280 boards may detach and cause component damage when they fall into the system.Create Date: Oct/31/03
SunAlert: No
Top FIN/FCO Report: No
Products Reference: Sun Fire V1280/Netra 1280
Product Category: Server / Service
Product Affected:
Systems Affected:
-----------------
Mkt_ID Platform Model Description Serial Number
------ -------- ----- ----------- -------------
- A40 ALL Sun Fire V1280 -
- N40 ALL Netra 1280 -
X-Options Affected:
-------------------
Mkt_ID Platform Model Description Serial Number
------ -------- ----- ----------- -------------
- - - - -
Parts Affected:
----------------------
Part Number Description Model
----------- ----------- -----
540-4979-07 ASSY CPU Motherboard LW8 -
540-5290-04 ASSY IO-SC Board Tested LW8 -
540-5565-03 ASSY IB_SSC Board Tested LW8 -
540-5521-01 ASSY L2 Repeater Board Tested -
References:
N/A
Issue Description:
EMI gaskets and spring fingers may detach from Sun Fire V1280 and Netra
1280 boards. If they fall into the system, they could cause physical
damage to the system and boards.
Any Sun Fire V1280 or Netra 1280 system could be affected by this
issue. Affected FRUs include the CPU/Memory Uniboard, IB_SSC Board,
and the Level 2 Repeater Board.
A change to the profile of the EMI gaskets on the Sun Fire V1280 and
Netra 1280 systems appears to be increasing the chance that the parts
will separate from the system. The failure rate is unknown at this
time, however, several incidents have been reported by the field.
The gaskets and spring fingers in question rub and the friction causes
the parts to separate. There is no way to inspect the attachment
points or for the field to reinforce them. Whether or not the parts
separate depends on manufacturing tolerances and assembly at the
factory. The separation is caused by a less than optimal attachment
and an increase is gasket profile which causes the parts to rub more
when a board is inserted.
Sun Engineering is in the process of updating the separating parts.
New parts are being designed which keep the parts more firmly fixed to
the system. The Field should be aware of this potential issue and make
sure that gaskets and spring fingers do not fall into the system and
cause damage.
Implementation:
---
| | MANDATORY (Fully Proactive)
---
---
| | CONTROLLED PROACTIVE (per Sun Geo Plan)
---
---
| X | REACTIVE (As Required)
---
Corrective Action:
The following recommendation is provided as a guideline for authorized
Sun Services Field Representatives who may encounter the above
mentioned issue.
Systems should be examined when any FRUs are replaced to verify that
the EMI gaskets and spring fingers are secured on the system. Also
visually inspect and verify whether the the EMI gaskets have loosened.
Extra care is needed when removing or inserting the FRU parts from the
chassis or system boards. Unnecessary board insertion and removal
should be avoided.
At some point, Engineering will release a service kit to fix this
issue. This FIN will be updated as soon as the service kit is
available to the field.
Comments:
None.
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Implementation Footnote:
i) In case of MANDATORY FINs, Sun Services will attempt to contact
all affected customers to recommend implementation of the FIN.
ii) For CONTROLLED PROACTIVE FINs, Sun Services mission critical
support teams will recommend implementation of the FIN (to their
respective accounts), at the convenience of the customer.
iii) For REACTIVE FINs, Sun Services will implement the FIN as the
need arises.
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