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Sun Blade X6275 IB

375-3603 540-7835 X6275-AA
System Board
Assembly/FRU
375-3603 +
Svc Proc 375-3611
X6275 Base
540-7835

Headers, Jumpers, and Switches

CODE LOCATION PINS SETTING DESCRIPTION
A J2 4 Out Not documented
B J3 1-2
3-4
Out
Out
Node0 FMD Discharge when installed
Node1 FMD Discharge when installed
C J11-1 4 Out Not documented (Node0)
D J11-2 4 Out Not documented (Node1)
E J13_1 1-2 Out Not documented (Node0)
F J13_2 1-2 Out Not documented (Node1)
G J16_1 2-3 In Not documented (Node0)
H J16_2 2-3 In Not documented (Node1)
I J18_1 2-3 In Not documented (Node0)
J J18_2 2-3 In Not documented (Node1)
K J22_1 3 Out Not documented (Node0)
L J22_2 3 Out Not documented (Node1)
M J29_1 10 Out Not documented (Node0)
N J29_2 10 Out Not documented (Node1)
O J31_1 10 Out Not documented (Node0)
P J31_2 10 Out Not documented (Node1)
Q J35_1 10 Out Not documented (Node0)
R J35_2 10 Out Not documented (Node1)
S J37_1 1-2 Out Not documented (Node0)
T J37_2 1-2 Out Not documented (Node1)
U J42_1 1-2 In Clear Node0 CMOS when 2-3 installed
V J42_2 1-2 In Clear Node1 CMOS when 2-3 installed
W J43_1 1-2 Out Not documented (Node0)
X J43_2 1-2 Out Not documented (Node1)
Y J44_1 1-2 Out Not documented (Node0)
Z J44_2 1-2 Out Not documented (Node1)
AA J57_1 1-2 In Node0 Boot Dest
BB J57_2 1-2 In Node1 Boot Dest
CC Jxx 1-2 Out Not Documented / Not silkscreened
DD Jyy 1-2 Out Not Documented / Not silkscreened

SW1_1 n/a n/a Host Reset (Node0)

SW1_2 n/a n/a Host Reset (Node1)

SW3_1 n/a n/a SP CPU Reset (Node0)

SW3_2 n/a n/a SP CPU Reset (Node1)

Sun Blade X6275 Codename: Vayu

Notes

  1. Heatsinks 310-0254 and 310-0255 are pre-greased with Shin-Etsu X23-7783D.
  2. The X6275 Blade FRU includes four 310-0065 Shin-Etsu X23-7783D syringes.
  3. The Sun Blade X6275 supports PCI Express 1.1 and 2.0.
  4. Sun Blade 6048 Midplane 501-7788 supports PCI Express 1.1.
  5. Sun Blade 6048 Midplanes 511-1212 and 511-1473 support PCI Express 2.0.
  6. The Sun Blade 6048 Midplane upgrade is B22-B-MP-UPGKIT.

Chassis Notes

  1. The X6275 IB is supported in Sun Blade 6048.
  2. The X6275 IB is not supported in Sun Blade 6000.

Memory Installation Notes

  1. The minimum configuration is three DIMMs per CPU in slots D1, D3, and D5.
  2. Memory speed is dependent on the number of DIMMs and the CPU Front Side Bus.
  3. Maximum speed is 1333MHz when 1333MHz DIMMs are installed in D1, D3, and D5.
  4. Maximum speed is 1066MHz when any speed DIMMs are installed in all slots.
  5. Use of the same DIMM size and speed is recommended for maximum performance.
  6. Node 0 and Node 1 require the same memory configuration.

References

  1. Sun Blade X6275 Server Module Service Manual, 820-6849.
  2. Sun Blade X6275 Server Module Product Notes, 820-6853.
  3. Sun Blade X6275 Server Module Installation Guide, 820-6977.



Sun Blade X6275 GbE

375-3604 540-7836 X6275-BA
System Board
Assembly/FRU
375-3604 +
Svc Proc 375-3611
X6275 Base
540-7836

Headers, Jumpers, and Switches

CODE LOCATION PINS SETTING DESCRIPTION
A J2 4 Out Not documented
B J3 1-2
3-4
Out
Out
Node0 FMD Discharge when installed
Node1 FMD Discharge when installed
C J11-1 4 Out Not documented (Node0)
D J11-2 4 Out Not documented (Node1)
E J13_1 1-2 Out Not documented (Node0)
F J13_2 1-2 Out Not documented (Node1)
G J16_1 2-3 In Not documented (Node0)
H J16_2 2-3 In Not documented (Node1)
I J18_1 2-3 In Not documented (Node0)
J J18_2 2-3 In Not documented (Node1)
K J22_1 3 Out Not documented (Node0)
L J22_2 3 Out Not documented (Node1)
M J29_1 10 Out Not documented (Node0)
N J29_2 10 Out Not documented (Node1)
O J31_1 10 Out Not documented (Node0)
P J31_2 10 Out Not documented (Node1)
Q J35_1 10 Out Not documented (Node0)
R J35_2 10 Out Not documented (Node1)
S J37_1 1-2 Out Not documented (Node0)
T J37_2 1-2 Out Not documented (Node1)
U J42_1 1-2 In Clear Node0 CMOS when 2-3 installed
V J42_2 1-2 In Clear Node1 CMOS when 2-3 installed
W J43_1 1-2 Out Not documented (Node0)
X J43_2 1-2 Out Not documented (Node1)
Y J44_1 1-2 Out Not documented (Node0)
Z J44_2 1-2 Out Not documented (Node1)
AA J57_1 1-2 In Node0 Boot Dest
BB J57_2 1-2 In Node1 Boot Dest
CC Jxx 1-2 Out Not Documented / Not silkscreened
DD Jyy 1-2 Out Not Documented / Not silkscreened

SW1_1 n/a n/a Host Reset (Node0)

SW1_2 n/a n/a Host Reset (Node1)

SW3_1 n/a n/a SP CPU Reset (Node0)

SW3_2 n/a n/a SP CPU Reset (Node1)

Sun Blade X6275 Codename: Vayu

Notes

  1. Heatsinks 310-0254 and 310-0255 are pre-greased with Shin-Etsu X23-7783D.
  2. The X6275 Blade FRU includes four 310-0065 Shin-Etsu X23-7783D syringes.
  3. The Sun Blade X6275 GbE requires a PCI Express 2.0 Midplane.
  4. Sun Blade 6000 A90-A Midplane 501-7376 supports PCI Express 1.1.
  5. Sun Blade 6000 A90-B Midplane 511-1298 supports PCI Express 2.0.
  6. The Sun Blade 6000 Midplane upgrade is A90-B-MP-UPGKIT.
  7. Sun Blade 6048 Midplane 501-7788 supports PCI Express 1.1.
  8. Sun Blade 6048 Midplanes 511-1212 and 511-1473 support PCI Express 2.0.
  9. The Sun Blade 6048 Midplane upgrade is B22-B-MP-UPGKIT.

Chassis Notes

  1. The X6275 GbE is supported in Sun Blade 6000 A90-A and A90-B, and in Sun Blade 6048.
  2. The X6275 GbE is not supported in Sun Blade 6000 A90-D.

Memory Installation Notes

  1. The minimum configuration is three DIMMs per CPU in slots D1, D3, and D5.
  2. Memory speed is dependent on the number of DIMMs and the CPU Front Side Bus.
  3. Maximum speed is 1333MHz when 1333MHz DIMMs are installed in D1, D3, and D5.
  4. Maximum speed is 1066MHz when any speed DIMMs are installed in all slots.
  5. Use of the same DIMM size and speed is recommended for maximum performance.
  6. Node 0 and Node 1 require the same memory configuration.

References

  1. Sun Blade X6275 Server Module Service Manual, 820-6849.
  2. Sun Blade X6275 Server Module Product Notes, 820-6853.
  3. Sun Blade X6275 Server Module Installation Guide, 820-6977.

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