Netra T5220 PCI Tray heatsink can sometimes fall off.

Asset ID:	1-73-1020379.1
Update Date:	2010-09-23
Keywords:

Solution Type FAB (standard) Sure

Solution 1020379.1 : Netra T5220 PCI Tray heatsink can sometimes fall off.

Impact

The heatsink could peal away and possibly fall onto the motherboard after shipment or during operation. There has been no reports or evidence of thermal issues on affected systems running at typical operational temperatures.

System should continue to operate normally but could be affected in higher ambient temperature environments.

Contributing Factors

This issue impacts Sun Netra T5220 systems with serial numbers earlier than 0846FM300K.

Symptoms

No operational problems have been noticed at typical operational temperatures, but a loose or detached heatsink should be addressed as soon as possible.

The below link (and/or attachment) provides a picture of a heatsink that has become detached and fallen onto the motherboard;

http://sdpsweb.central/FIN_FCO/FAB/257208/SPE/Loose_Heatsink.jpg

Root Cause

During the first six months of production, Sun's supply partner sometimes failed to properly attach the heatsink to a chip on some PCI Trays. The film cover that protects the heatsink's adhesive compound was not always removed prior heatsink attachment to the IC on the PCI Tray.

To rectify this issue the assembly instructions were modified in November of 2008 to ensure that this film was removed prior heatsink attachment. This issue was resolved in Manufacturing via StopShip/Purge P001-20583 and in Services via GSAP 4581.

Corrective Action

Workaround:

No workaround available - see Resolution section below.

Resolution:

Upon Failure only (detached heatsink) replace 371-2700-02 (or below) with 371-2700-02 that contains label "P001-20583" or "GSAP 4581".

Identification of Affected Parts (how to):

371-2700-02 (or below) without "P001-20583" or "GSAP 4581" label may be affected.

Comments

This issue was evaluated and determined not to meet FCO criteria because of the low potential for exposure and low impact to the installed base.

References:

BugID: 6770438
ECO: WO_39984
GSAP: 4581
WW Stop Ship: P001-20583
Radiance ID: 11321735

For information about FAB documents, its release processes, implementation strategies and billing information, go to the following URL:

http://tns.central/fab

For Sun Authorized Service Providers go to:

http://tns.central/SPE/fab/

In addition to the above you may email:

FAB-Manager@sun.com

Modification History
Changes made since initial publication.

20-Apr-2009

Added picture of detached heatsink via an attachment and a link in the Symptoms section.

18-May-2009

Changed affected p/n from 371-2700-02 to 371-2700-02 (or below).
Changed Resp Eng from Mike Figueroa to Jim Ye.
Changed Resp Mgr from Thomas Paolucci to Art Weigel.

Internal Contributor/submitter
Donald.Drygalski@Sun.COM

Internal Eng Responsible Engineer
Jim.Ye@Sun.COM Responsible Manager: Art.Weigel@Sun.COM

Internal Services Knowledge Engineer
Joe.Davis@Sun.COM

Internal Eng Business Unit Group
SSG NSN (Netra Systems and Networking)

Internal Sun Alert & FAB Admin Info
15-Apr-2009: Completed draft and sent to Extended Review.
17-Apr-2009: No feedback from Ext Rvw - sending to Publish.

Attachments

This solution has no attachment