Asset ID:	1-73-1107021.1
Update Date:	2010-08-05
Keywords:

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Solution Type  FAB (standard) Sure

Solution  1107021.1 :   Motherboards returning with bent pins on CPU socket.  

In this Document
  Symptoms
  Changes
  Cause
  Solution

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Oracle Confidential (PARTNER). Do not distribute to customers
Reason: FABs are available to Internals and Partners only

Applies to:

Sun Fire X4170 Server - Version: Not Applicable to Not Applicable - Release: NA to NA
Sun Fire X4270 Server - Version: Not Applicable to Not Applicable   [Release: NA to NA]
Sun Fire X4275 Server - Version: Not Applicable to Not Applicable   [Release: NA to NA]
Sun Blade X6270 Server Module - Version: Not Applicable to Not Applicable   [Release: NA to NA]
Sun Blade X6275 Server Module - Version: Not Applicable to Not Applicable   [Release: NA to NA]
Information in this document applies to any platform.

Symptoms

Spares are being returned with CPU socket bent pin issue.

Impact

Many defective returns of the part numbers listed in the Contributing Factors section have been received with CPU socket bent pin issues from the field, due to incorrect assembly and/or dis-assembly on CPU during service.

This issue is increasing the unnecessary returns for repair as well as increasing the cost of service for this product.

Changes

Contributing Factors

Improper handling procedures in the field are contributing to this issue, affecting the following part numbers;

  540-7835 - Motherboard, Sun Blade X6275 RoHS:Y
  541-2860 - Motherboard, Sun Blade X6270 RoHS:Y
  375-3602 - Motherboard, Sun Fire X2270 Server RoHS:Y
  541-2542 - Motherboard, Sun Fire X4170, X4270, X4275 RoHS:Y

Cause

Root Cause
Service personnel or customers are incorrectly assembling or disassembling the CPU to/from the Motherboard and causing bent pins on CPU socket.

Solution

Workaround

See Resolution section below.


Field service personnel should ensure they follow the replacement guidelines as shown in the below linked document;

http://sdpsweb.central/FIN_FCO/FAB/1107021.1/SPE/CPU_Assembly_and_Disassembly_Operation.pdf



For information about FAB documents, its release processes, implementation strategies and billing information, go to the following URL:

* http://tns.central/fab

In addition to the above you may email:

* FAB-Manager@sun.com


Contributor/submitter
maryjane.krebser@oracle.com

Responsible Engineer
maryjane.krebser@oracle.com

Services Knowledge Engineer
Joe.Davis@Oracle.COM

Eng Business Unit Group
Services


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