Thermal Grease syringes not usable when replacing X64 processors or system boards.

Asset ID:	1-73-1152093.1
Update Date:	2010-07-20
Keywords:

Solution Type FAB (standard) Sure

Solution 1152093.1 : Thermal Grease syringes not usable when replacing X64 processors or system boards.

Applies to:

Sun Ultra 27 Workstation - Version: Not Applicable to Not Applicable - Release: NA to NA
Sun Blade X6275 Server Module - Version: Not Applicable to Not Applicable   [Release: NA to NA]
Sun Blade X6270 Server Module - Version: Not Applicable to Not Applicable   [Release: NA to NA]
Sun Blade X6250 Server Module - Version: Not Applicable to Not Applicable   [Release: NA to NA]
Information in this document applies to any platform.
__________

Affected Parts: (FRU/CRU Part Number / Description)

350-1271-01 - Thermal Grease FRU with Alcohol Wipe

Symptoms

The Field Engineer may not be able to perform CPU or Motherboard FRU replacement because of the poor quality and/or volume of the thermal grease provided in the FRU kit.

Impact

When servicing a customer for a CPU or Motherboard replacement on any of the above listed Products, the thermal paste (included in the FRU) may be unusable. The grease inside the syringes may be too thick to be used, or the amount of grease will not be enough to cover the CPU properly.

If this issue is experienced, the Field Engineer will need to order and wait for the Thermal Grease FRU Kit before the CPU or Motherboard can be replaced, causing increased downtime for the customer.

Changes

Contributing Factors

This issue could impact the replacement of CPU or Motherboard on any of the Platforms listed in the Products section above, but has only been observed on the Sun Blade X6275.

Cause

Root Cause

The sourcing process used by Oracle supplier in the acquisition of the affected Thermal Grease Syringes was identified as the root cause.

The sources of these syringes were not properly storing the thermal grease or controlling the volume. This lead to grease that was too thick to apply and/or had an insufficient volume of grease. This sourcing issue has now been addressed.

All syringes in affected Motherboard and CPU FRUs have been reworked in Manufacturing with the proper grease as of May 1, 2010.

Services spares inventory was not purged due to significant usage rates of spares containing the thermal grease syringes limits the potential of this issue being experienced.

Solution

Workaround

No workaround available - see Resolution section.

Resolution

It is recommended that FEs supporting Motherboard and CPU replacements on the above listed products order extras of the Thermal Grease FRU (P/N 350-1271-01) to have on hand during repair in case the Motherboard or CPU spare has unusable thermal grease.

Comments

Service Logistics will monitor usage on the Thermal Grease FRU to ensure proper stocking levels are maintained.

References

PITT# 3087
URL: http://pitt2.uk.sun.com/index.php

For information about FAB documents, its release processes, implementation strategies and billing information, go to the following URL:

* http://tns.central/fab

In addition to the above you may email:

* FAB-Manager@sun.com

Contacts

Contributor: barry.wright@oracle.com
Responsible Engineer: michael.boone@oracle.com
Responsible Manager: shailesh.patel@oracle.com, andy.zarcone@oracle.com
Business Unit Group: Systems Group-x64

Attachments

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